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TFDU7100
Vishay Semiconductors
Infrared Transceiver Module (FIR, 4 Mbit/s) for IrDA(R) combined with Remote Control Receiver (36 kHz to 38 kHz Carrier)
Description
The TFDU7100 IrDA compliant transceiver is a multimedia module that supports IrDA data transfer up to 4 Mbit/s (FIR) and bidirectional Remote Control operating over a range of more than 18 m. Integrated within the transceiver are two PIN photodiodes, an infrared emitter (IRED) and two low-power control IC. It is ideal for applications requiring both Remote Control and IrDA communication.
19584
Features
* Compliant to the latest IrDA physical layer specification (9.6 kbit/s to 4 Mbit/s) * TV Remote Control receiver with 18 m e3 receive range * Remote Control carrier frequency 36 kHz to 38 kHz * Operates from 2.7 V to 5.5 V within specification over full temperature range from - 25 C to + 85 C * Surface Mount Package, low profile (L 9.9 mm x 4.1 mm x 4 mm) * Compliant with IrDA Background Light Specification * EMI Immunity > 300 Vrms/m in GSM Bands verified (according IEC61000-4-3) * Lead (Pb)-free device * Qualified for lead (Pb)-free and Sn/Pb processing (MSL4) * Qualified for lead (Pb)-free and lead (Pb)-bearing soldering processes * Device in accordance with RoHS 2002/95/EC and WEEE 2002/96/EC * Split power supply, transmitter and receiver can be operated from two power supplies with relaxed requirements saving costs, US - Patent - No. 6,157,476
Applications
* Remote control and IrDA communication in Multimedia * Notebook computers, Desktop PC's, Internet TV Boxes, Video Conferencing Systems * Digital Still and Video Cameras * Printers, fax machines, Photocopiers, Screen Projectors
Parts Table
Part TFDU7100-TR3 TFDU7100-TT3 Description Oriented in carrier tape for side view surface mounting Oriented in carrier tape for top view surface mounting Qty/Reel 1000 pcs 1000 pcs
Document Number 84773 Rev. 1.1, 27-Sep-06
www.vishay.com 1
TFDU7100
Vishay Semiconductors Functional Block Diagram
Open Collector Output Amplifier Envelope Generator
RC-RXD
Push-Pull Driver Amplifier Comparator RXD
VCC2
SD
Logic &
Control TXD VCC1
Controlled Driver
GND
19597
Figure 1. Functional Block Diagram
Pin Description
Pin Number 1 Function VCC2 IRED Anode Description IRED anode to be externally connected to VCC2. An external resistor is only necessary for controlling the IRED current when a current reduction below 300 mA is intended. This pin is allowed to be supplied from an uncontrolled power supply separated from the controlled VCC1 - supply IRED Cathode, internally connected to the driver transistor This Schmitt-Trigger input is used to transmit serial data when SD is low. An on-chip protection circuit disables the IRED driver if the TXD pin is asserted for longer than 80 s. Received Data Output, push-pull CMOS driver output capable of driving standard CMOS or TTL loads. During transmission the RXD output is active (echo-on). No external pull-up or pull-down resistor is required. Floating with a weak pull-up of 500 k (typ.) in shutdown mode. Shutdown for IRDA channel only Supply Voltage Open Collector Output. This output is active during transmission (echo-on). External pull-up resistor to be added (e.g. 10 k). Ground O LOW I HIGH I/O Active
2 3
IRED Cathode TXD
4
RXD
O
LOW
5 6 7 8
SD VCC1 RC-RXD GND
I
HIGH
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Document Number 84773 Rev. 1.1, 27-Sep-06
TFDU7100
Vishay Semiconductors Absolute Maximum Ratings
Reference point Pin: GND unless otherwise noted. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. Parameter Supply voltage range, transceiver Supply voltage range, transmitter Voltage at RXD Input currents Output sinking current Power dissipation Junction temperature Ambient temperature range (operating) Storage temperature range Soldering temperature Average output current, pin 1 Repetitive pulse output current, pin 1 to pin 2 Virtual source size Maximum Intensity for Class 1 < 0.3 s, ton < 25 % Method: (1 - 1/e) encircled energy IEC60825-1 or EN60825-1, edition Jan. 2001, operating below the absolute maximum ratings See recommended solder profile (see figure 5) IIRED (DC) IIRED (RP) d Ie 2.5 2.8
*)
Test Conditions - 0.3 V < VCC2 < 6 V - 0.5 V < VCC1 < 6 V - 0.5 V < VCC1 < 6.0 V For all Pins, Except IRED Anode Pin see derating curve
Symbol VCC1 VCC2 VRXD Vin
Min - 0.5 - 0.5 - 0.5 - 0.5
Typ.
Max + 6.0 + 6.0 VCC1 + 0.5 + 6.0 10 25
Unit V V V V mA mA mW C C C C mA mA mm
Voltage at all inputs and outputs Vin > VCC1 is allowed
PD TJ Tamb Tstg - 30 - 40
250 125 + 85 + 100 260 125 700
(500)**)
mW/sr
*)
Due to the internal limitation measures the device is a "class1" device under all conditions. IrDA specifies the max. intensity with 500 mW/sr.
**)
Definitions: In the Vishay transceiver data sheets the following nomenclature is used for defining the IrDA operating modes: SIR: 2.4 kbit/s to 115.2 kbit/s, equivalent to the basic serial infrared standard with the physical layer version IrPhy 1.0 MIR: 576 kbit/s to 1152 kbit/s FIR: 4 Mbit/s VFIR: 16 Mbit/s MIR and FIR were implemented with IrPhy 1.1, followed by IrPhy 1.2, adding the SIR Low Power Standard. IrPhy 1.3 extended the Low Power Option to MIR and FIR and VFIR was added with IrPhy 1.4. A new version of the standard in any case obsoletes the former version. With introducing the updated versions the old versions are obsolete. Therefore the only valid IrDA standard is the actual version IrPhy 1.4 (in Oct. 2002).
Document Number 84773 Rev. 1.1, 27-Sep-06
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TFDU7100
Vishay Semiconductors Electrical Characteristics Transceiver
Tested at Tamb = 25 C, VCC1 = VCC2 = 2.7 V to 5.5 V unless otherwise noted. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. Parameter Supply voltage Dynamic supply current Average dynamic supply current, transmitting Shutdown supply current*) Operating temperature range Output voltage low, RXD Output voltage high, RXD RXD to VCC1 impedance Input voltage low (TXD, SD) Input voltage high (TXD, SD) Input leakage current (TXD, SD) Controlled pull down current Vin = 0.9 x Vlogic SD, TXD = "0" or "1" 0 < Vin < 0.15 VCC1 SD, TXD = "0" or "1" Vin > 0.7 VCC1 Input capacitance (TXD, SD)
*) **)
Test Conditions klx**),
Symbol VCC1 ICC1 ICC ISD TA
Min 2.7
Typ.
Max 5.5 5 6.5 2
Unit V mA mA mA C V V V k V V A A A pF
SD = Low, Ee = 1
VCC1
IIRED = 300 mA, 25 % Duty Cycle SD = High, T = 25 C, Ee = 0 klx Cload = 15 pF IOH = - 500 A IOH = - 250 A, Cload = 15 pF
- 30 - 0.5 0.8 x VCC1 0.9 x VCC1 400 - 0.5 VCC1 - 0.5 -2 500
+ 85 0.15 x VCC1 VCC1 + 0.5 600 0.5 6 +2 + 150
VOL VOH RRXD VIL VIH IICH IIrTX IIrTX CI
-1
0
1 5
The Remote Control receiver is always on. The shutdown function is used for disabling the IrDA channel, only Standard Illuminant A
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Document Number 84773 Rev. 1.1, 27-Sep-06
TFDU7100
Vishay Semiconductors Optoelectronic Characteristics Receiver
Tested at Tamb = 25 C, VCC1 = vCC2 = 2.7 V to 5.5 V unless otherwise noted. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. Parameter Minimum detection threshold irradiance, SIR mode*)**) Test Conditions 9.6 kbit/s to 115.2 kbit/s = 850 nm - 900 nm = 0, 15 576 kbit/s to 4 Mbit/s = 850 nm - 900 nm = 0, 15 Maximum irradiance in angular range***) Logic LOEW receiver input irradiance = 850 nm - 900 nm tr, tf < 40 ns, tpo = 1.6 s at f = 115 kHz, no output signal allowed 10 % to 90 %, CL = 15 pF 90 % to 10 %, CL = 15 pF Input pulse length 1.4 s < PWopt < 25 s Input pulse length 1.4 s < PWopt < 25 s - 25 C < T < 85 C**) RXD pulse width of output signal, 50 % MIR mode RXD pulse width of output signal, 50 % FIR mode Input pulse length PWopt = 217 ns, 1.152 Mbit/s Input pulse length PWopt = 125 ns, 4.0 Mbit/s Input pulse length PWopt = 250 ns, 4.0 Mbit/s Stochastic jitter, leading edge
2
Symbol Ee
Min
Typ. 45 (4.5) 100 (10) 5 (500)
Max 81 (8.1) 190 (19)
Unit mW/m2 (W/cm2) mW/m2 (W/cm2) kW/m2 (mW/cm2) mW/m2 (W/cm2)
Ee
= 850 nm - 900 nm
Ee Ee 4 (0.4)
Rise time of output signal Fall time of output signal RXD pulse width of output signal, 50 % SIR Mode
tr (RXD) tf (RXD) tPW tPW 1.5 2.1 1.8
40 40
ns ns s
2.6
s
tPW tPW tPW tPW
110 100 225 225
250
270 140 275 275 20 40 80 350 500
ns ns ns ns ns ns ns ns s
Ee = 200 mW/m , 4 Mbit/s Ee = 200 mW/m2, 1.152 kbit/s Input irradiance = 100 mW/m2, 576 kbit/s Ee = 200 mW/m2, 115.2 kbit/s
Receiver start-up time
After completion of shutdown programming sequence Power on delay
*)
IrDA low power specification is 90 mW/m2. Spec takes a window loss 10 % into account.
**)
IrDA sensitivity definition: Minimum Irradiance Ee In Angular Range, power per unit area. The receiver must meet the BER specification while the source is operating at the minimum intensity in angular range into the minimum half-angle range at the maximum Link Length.
***)
Maximum Irradiance Ee In Angular Range, power per unit area. The optical delivered to the detector by a source operating at the maximum intensity in angular range at Minimum Link Length must not cause receiver overdrive distortion and possible related link errors. If placed at the Active Output Interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER) specification For more definitions see the document "Symbols and Terminology" on the Vishay Website (http://www.vishay.com/docs/82512/82512.pdf).
Document Number 84773 Rev. 1.1, 27-Sep-06
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TFDU7100
Vishay Semiconductors Remote Control Receiver*)
Tested at Tamb = 25 C, VCC1 = vCC2 = 2.7 V to 5.5 V unless otherwise noted. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing Parameter Minimum detection threshold irradianceRC Maximum detection threshold irradiance Minimum detection threshold irradiance) Maximum detection threshold irradiance Output voltage low, RC-RXD Output voltage high, RC-RXD
*) **)
Test Conditions = 950 nm = 0, 15, RC5/RC6, 36 kHz = 950 nm = 0, 15, 36 kHz to 38 kHz = 850 nm - 970 nm = 850 nm - 900 nm CLoad = 15 pF, RL = 10 k)
Symbol EeRC EeRC EeRC EeRCmax VOLRC VHLRC
Min
Typ. 0.4 (0.04) 0.4 (0.04) 0.4 (0.04)
Max
Unit mW/m2 (W/cm2)
1 2
mW/m2 (W/cm2) mW/m2 (W/cm2) W/m2
30 - 0.5 VCC1 0.15 x VCC1
V V
CLoad = 15 pF, RL = 10 k)
Timing parameters are equivalent to TSOP1238, see that datasheet. The RC-RXD output is an open collector output, therefore a load resistor is mandatory.
Optoelectronic Characteristics Transmitter
Tested at Tamb = 25 C, VCC1 = vCC2 = 2.7 V to 5.5 V unless otherwise noted. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing Parameter IRED operating current limitation IRED operating current limitation for low power FIR mode Output leakage IRED current Output radiant intensity Test Conditions No external resistor for current limitation*) VCC2 = 3.3 V, RS = 18 , Ie 10 mW/sr TXD = 0 V, 0 < VCC1 < 5.5 V = 0, 15, full IrDA cone, TXD = High, SD = Low, no external resistor for current limitation*) = 0 TXD = High, SD = Low, no external resistor for current limitation*) VCC1 = 5.0 V, = 0, 15 TXD = Low or SD = High (Receiver is inactive as long as SD = High) Peak - emission wavelength**) Spectral bandwidth Optical rise time, fall time Optical output pulse duration Input pulse width 1.63 s, 115.2 kbit/s (SIR) Input pulse width 217 ns, 1.152 Mbit/s Input pulse width 125 ns, 4.0 Mbit/s Input pulse width 250 ns, 4.0 Mbit/s Input pulse width 0.1 s, < tTXD < 100 s Input pulse width 0.1 s, tTXD 100 s Optical overshoot
*)
Symbol ID ID
Min 450
Typ. 550 90
Max 650
Unit mA mA
IIRED Ie
-1 50 70
1 300
A mW/sr
Ie
80
200
400
mW/sr
Ie p tropt, tfopt topt topt topt topt topt topt tTXD 10 1.6 207 117 242 1.63 217 125 250 tTXD
0.04
mW/sr
880 45
900 40 1.75 227 133 258
nm nm ns s ns ns ns s
100 25
s %
Using an external current limiting resistor is allowed and recommended to reduce IRED intensity and operating current when current reduction is intended to operate at the IrDA low power conditions. E.g. for VCC2 = 3.3 V a current limiting resistor of Rs = 56 will allow a power minimized operation at IrDA low power conditions.
**)
Note: Due to this wavelength restriction compared to the IrDA spec of 850 nm to 900 nm the transmitter is able to operate as source for the standard Remote Control applications with codes as e.g. Philips RC5/RC6(R) or RECS 80.
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Document Number 84773 Rev. 1.1, 27-Sep-06
TFDU7100
Vishay Semiconductors Recommended Circuit Diagram
Operated at a clean low impedance power supply the TFDU7100 needs no additional external components beside a resistor at the open collector RC-RXD-output. However, depending on the entire system design and board layout, additional components may be required (see figure 2). of the supply voltages VCCx and injected noise. An unstable power supply with dropping voltage during transmission may reduce the sensitivity (and transmission range) of the transceiver. The placement of these parts is critical. It is strongly recommended to position C2 as close as possible to the transceiver power supply pins. An Tantalum capacitor should be used for C1 while a ceramic capacitor is used for C2. In addition, when connecting the described circuit to the power supply, low impedance wiring should be used. When extended wiring is used the inductance of the power supply can cause dynamically a voltage drop at VCC2. Often some power supplies are not apply to follow the fast current rise time. In that case another 4.7 F (type, see table under C1) at VCC2 will be helpful. The RC-RXD output is an open collector driver. Therefore it needs an external pull-up resistor of e.g. 10 k (R3). Under extreme EMI conditions as placing an RFtransmitter antenna on top of the transceiver, we recommend to protect all inputs by a low-pass filter, as a minimum a 12 pF capacitor, especially at the RXD port. The transceiver itself withstands EMI at GSM frequencies above 500 V/m. When interference is observed, it is picked up by the wiring to the inputs. It is verified by DPI measurements that as long as the interfering RF - voltage is below the logic threshold levels of the inputs and equivalent levels at the outputs no interference is expected. One should keep in mind that basic RF - design rules for circuit design should be taken into account. Especially longer signal lines should not be used without termination. See e.g. "The Art of Electronics" Paul Horowitz, Winfield Hill, 1989, Cambridge University Press, ISBN: 0521370957.
VIRED VCC C1 GND R3 RC-RXD SD TXD RXD
R1 R2 C2
IRED Anode VCC1 Ground RC-RXD SD TXD RXD IRED Cathode
19600
Figure 2. Recommended Application Circuit
The capacitor C1 is buffering the supply voltage and eliminates the inductance of the power supply line. This one should be a Tantalum or other fast capacitor to guarantee the fast rise time of the IRED current. The resistor R1 is the current limiting resistor, which may be used to reduce the operating current to levels below the specified controlled values for saving battery power. Vishay's transceivers integrate a sensitive receiver and a built-in power driver. The combination of both needs a careful circuit board layout. The use of thin, long, resistive and inductive wiring should be avoided. The inputs (TXD, SD) and the output RXD should be directly (DC) coupled to the I/O circuit. The capacitor C2 combined with the resistor R2 is the low pass filter for smoothing the supply voltage. R2, C1 and C2 are optional and dependent on the quality
Recommended Application Circuit Components
Component C1 C2 R1 R2 R3 Recommended Value 4.7 F, 16 V 0.1 F, Ceramic depends on current to be adjusted 47 , 0.125 W 10 k, 0.125 W CRCW-0805-47R CRCW-0805-10K Vishay Part Number 293D 475X9 016B VJ 1206 Y 104 J XXMT
Document Number 84773 Rev. 1.1, 27-Sep-06
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TFDU7100
Vishay Semiconductors I/O and Software
In the description, already different I/Os are mentioned. Different combinations are tested and the function verified with the special drivers available from the I/O suppliers. In special cases refer to the I/ O manual, the Vishay application notes, or contact directly Vishay Sales, Marketing or Application. After that TXD is enabled as normal TXD input and the transceiver is set for the high bandwidth (576 kbit/ s to 4 Mbit/s) mode.
Setting to the Lower Bandwidth Mode (2.4 kbit/s to 115.2 kbit/s)
1. Set SD input to logic "HIGH". 2. Set TXD input to logic "LOW". Wait ts > 200 ns. 3. Set SD to logic "LOW" (this negative edge latches state of TXD, which determines speed setting). 4. TXD must be held for th > 200 ns. After that TXD is enabled as normal TXD input and the transceiver is set for the lower bandwidth (9.6 kbit/s to 115.2 kbit/s) mode.
Mode Switching
The TFDU7100 is in the SIR mode after power on as a default mode, therefore the FIR data transfer rate has to be set by a programming sequence using the TXD and SD inputs as described below. The low frequency mode covers speeds up to 115.2 kbit/s. Signals with higher data rates should be detected in the high frequency mode. Lower frequency data can also be received in the high frequency mode but with reduced sensitivity. To switch the transceivers from low frequency mode to the high frequency mode and vice versa, the programming sequences described below are required. The SD-pulse duration for programming should be limited to a maximum of 5 s avoiding that the transceiver goes into sleep mode.
SD
50 %
ts TXD 50 %
th High : FIR 50 % Low : SIR
Setting to the High Bandwidth Mode (0.576 Mbit/s to 4.0 Mbit/s)
1. Set SD input to logic "HIGH". 2. Set TXD input to logic "HIGH". Wait ts > 200 ns. 3. Set SD to logic "LOW" (this negative edge latches state of TXD, which determines speed setting). 4. After waiting th > 200 ns TXD can be set to logic "LOW". The hold time of TXD is limited by the maximum allowed pulse length.
14873
Figure 3. Mode Switching Timing Diagram
Table 2. Truth table
Inputs SD high low low x low low TXD x high high > 100 s low low low Optical input Irradiance mW/m2 x x x > specified RC sensitivity (RCprotocol) <4 > minimum irradiance in angular range (IrDA) < maximum irradiance in angular range (IrDA) > maximum irradiance in angular range (IrDA) RXD weakly pulled (500 k to VCC1) active low (echo) high x high low (active) Outputs Transmitter 0 Ie 0 0 0 0 Remark RC-RXD x x x active low (envelope) x x
low
low
x
0
x
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Document Number 84773 Rev. 1.1, 27-Sep-06
TFDU7100
Vishay Semiconductors Recommended Solder Profiles
Solder Profile for Sn/Pb Soldering
260 240 220 200 180 160 140 120 100 80 60 40 20 0
19535
10 s max. at 230 C 240 C max. 2...4 C/s 160 C max. 120 s...180 s
on the packing and also in the application note "Taping, Labeling, Storage and Packing" (http://www.vishay.com/docs/82601/82601.pdf).
275 250 225 200 T 255 C for 10 s....30 s T 217 C for 70 s max Tpeak = 260 C
Temperature (C)
90 s max.
Temperature/C
175 150 125 100 75 90 s...120 s 70 s max. 2 C...4 C/s 2 C...3 C/s 30 s max.
2...4 C/s
0
50
100
150 Time/s
200
250
300
350
50 25 0 0
Figure 4. Recommended Solder Profile for Sn/Pb soldering
50
100
Lead (Pb)-Free, Recommended Solder Profile The TFDU7100 is a lead (Pb)-free transceiver and qualified for lead (Pb)-free processing. For lead (Pb)free solder paste like Sn (3.0 - 4.0) Ag (0.5 - 0.9) Cu, there are two standard reflow profiles: Ramp-SoakSpike (RSS) and Ramp-To-Spike (RTS). The RampSoak-Spike profile was developed primarily for reflow ovens heated by infrared radiation. With widespread use of forced convection reflow ovens the Ramp-ToSpike profile is used increasingly. Shown below in figure 5 and 6 are VISHAY's recommended profiles for use with the TFDU7100 transceivers. For more details please refer to the application note "SMD Assembly Instructions" (http://www.vishay.com/docs/82602/82602.pdf). A ramp-up rate less than 0.9 C/s is not recommended. Ramp-up rates faster than 1.3 C/s could damage an optical part because the thermal conductivity is less than compared to a standard IC. Wave Soldering For TFDUxxxx and TFBSxxxx transceiver devices wave soldering is not recommended. Manual Soldering Manual soldering is the standard method for lab use. However, for a production process it cannot be recommended because the risk of damage is highly dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned application note, describing manual soldering and desoldering. Storage The storage and drying processes for all VISHAY transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4. The data for the drying procedure is given on labels
Document Number 84773 Rev. 1.1, 27-Sep-06
19532
150 200 Time/s
250
300
350
Figure 5. Solder Profile, RSS Recommendation
280 260 240 220 200 180 Temperature/C 160 140 120 100 80 60 40 20 0 0 50 100 150 Time/s 200 250 300
Tpeak = 260 C max
< 4 C/s 1.3 C/s
Time above 217 C t 70 s Time above 250 C t 40 s Peak temperature Tpeak = 260 C
< 2 C/s
Figure 6. RTS Recommendation
Current Derating Diagram
Figure 7 shows the maximum operating temperature when the device is operated without external current limiting resistor.
90
Ambient Temperature (C )
85 80 75 70 65 60 55 50 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
18097
Operating Voltage [V] at duty cycle 20 %
Figure 7. Current Derating Diagram www.vishay.com 9
TFDU7100
Vishay Semiconductors Optical Window
For the design of the optical windows see application note "Window Size in Housings"
TFDU7100 - (Universal) Package
19586
Figure 8. Package drawing TFDU7100, dimensions in mm, tolerance 0.2 if not otherwise mentioned
7x1=7 0.6
2.5 1 1
19587
8
Figure 9. Recommended solder pad layout
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Document Number 84773 Rev. 1.1, 27-Sep-06
TFDU7100
Vishay Semiconductors Tape and Reel Reel dimensions
Drawing-No.: 9.800-5090.01-4 Issue: 1; 29.11.05
14017
Figure 10. Reel dimensions, tolerance 0.2 mm, if not otherwise mentioned Tape Width mm 24 A max. mm 330 N mm 60 W1 min. mm 24.4 W2 max. mm 30.4 W3 min. mm 23.9 W3 max. mm 27.4
Document Number 84773 Rev. 1.1, 27-Sep-06
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TFDU7100
Vishay Semiconductors Tape Dimensions
19819
Drawing-No.: 9.700-5251.01-4 Issue: 3; 02.09.05 Figure 11. Tape dimensions, tolerance 0.2 mm, if not otherwise mentioned
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Document Number 84773 Rev. 1.1, 27-Sep-06
TFDU7100
Vishay Semiconductors Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.
We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Document Number 84773 Rev. 1.1, 27-Sep-06
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Legal Disclaimer Notice
Vishay
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc., or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Vishay for any damages resulting from such improper use or sale.
Document Number: 91000 Revision: 08-Apr-05
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